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Description

FEATURES

Multilayer monolithic construction yields high reliability

Low insertion loss and small size SMD chip design

Can simplify your complex tuning and circuit design

APPLICATIONS

WLan IEEE 802.11b~g and Bluetooth module.

RF and Wireless Communication system.

Product Identification 

MGMB     21      H        2     -     2450         B05

          ①         ②      ③       ④             ⑤            ⑥

① Series name

② Dimension产 L×W:【21: 2.0mm×1.25mm  18: 1.6mm×0.8mm】
    ③ Design series : [H: via design series    P: plane design series 

④ Impedance Conversion  unit: [1=50Ω:50Ω   2=50Ω:100Ω   3=50Ω:200Ω]
    ⑤ center frequency: 2450MHz
    ⑥ Balance type

Product Specification

 

Part No.

Dimensions

L×W(mm)

Unbalance Port Impedance

(Ω)

Balance Port Impedance

(Ω)

Center Frequency

fo

(MHz)

Insertion Loss

(dB)

MGMB21H1-2450B05

2.0×1.25

50

10050 +50

2450

1.0max.(at 25 C)

MGMB21H1-2450B06

2.0×1.25

50

5025 +25

2450

1.3max.(at 25 C)

MGMB18H3-2450B08

1.6×0.8

50

200100 +100

2450

1.2max.(at 25 C)

MGMB18H4-2450B09

1.6×0.8

50

Conjugate to Atheros IC

2450

1.2max.(at 25 C)

MGMB15H4-2450B10

1.0×0.5

50

Conjugate to Atheros IC

2450

1.4max.(at 25 C)

MGMB18H1-2450B12

1.6×0.8

50

5025 +25

2450

1.2max.(at 25 C)

MDBF21L914H1897M -DB01

 

2.0×1.25

50

200100+100

914.5

1.8 max.(at 25 C)

1897.5

1.9 max.(at 25 C)


 

 

 

 

 

 

 

 

 

 

 

 

 

 


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